Science Advances

Supplementary Materials

This PDF file includes:

  • section S1. Optical simulations
  • section S2. Lasing properties of mixed-order DFB devices
  • section S3. Optical gain
  • section S4. Transient absorption
  • section S5. Thermal simulations
  • fig. S1. Schematic of the geometry used for optical simulation.
  • fig. S2. Lasing threshold of mixed-order DFB lasers based on BSBCz:CBP (6:94 wt %) 200-nm-thick film for different dimensions of the second-order gratings.
  • fig. S3. Photophysical properties of films with and without encapsulation.
  • fig. S4. Characterization of the pulsed organic lasers.
  • fig. S5. qCW lasing threshold.
  • fig. S6. Lasing threshold measured in forward (increasing repetition rate) and reverse (decreasing repetition rate) directions as a function of the repetition rate.
  • fig. S7. Significant reduction of degradation in encapsulated DFB devices.
  • fig. S8. Stability of the qCW laser.
  • fig. S9. Optical net gain under long-pulse operation.
  • fig. S10. Emission spectra of encapsulated 20 wt % blend mixed-order DFB lasers measured at a pumping intensity of 200 W cm−2 and 2.0 kW cm−2 for long-pulse durations of 800 μs and 30 ms, respectively.
  • fig. S11. Streak camera image showing laser emission integrated over 100 pulses from an encapsulated mixed-order DFB device during a 30-ms-long photoexcitation with a pump power of 2.0 kW cm−2.
  • fig. S12. Lack of triplet losses in the gain medium.
  • fig. S13. Divergence of DFB laser.
  • fig. S14. Polarization of DFB laser.
  • fig. S15. Lasing threshold under long-pulse operation.
  • fig. S16. Excitation duration dependence of the lasing threshold.
  • fig. S17. Laser-induced thermal degradation.
  • fig. S18. Schematic of the geometry used for thermal simulation.
  • fig. S19. Maximum temperature rise at the end of each pulse.
  • fig. S20. Temperature rise as a function of time with different pulse widths.
  • fig. S21. Temperature rise as a function of time for a pulse width of 10 ms in the devices with and without encapsulation.
  • fig. S22. Temperature rise as a function of time or number of pulses of τp = 30 ms in the gain region.
  • table S1. Film thickness, lasing wavelength, confinement factor, and quality factor.
  • table S2. Grating depth, lasing wavelength, confinement factor, and quality factor.
  • table S3. Comparison between devices with and without encapsulation, lasing wavelength, confinement factor, and quality factor.
  • table S4. Pulse width, excitation power, net gains, and loss coefficient.
  • table S5. Thermophysical and geometrical parameters of the materials.
  • References (50–52)

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