Research ArticleENGINEERING

Instant tough bonding of hydrogels for soft machines and electronics

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Science Advances  21 Jun 2017:
Vol. 3, no. 6, e1700053
DOI: 10.1126/sciadv.1700053

Article Information

vol. 3 no. 6

Online ISSN: 
History: 
  • Received for publication January 5, 2017
  • Accepted for publication May 5, 2017
  • .

Author Information

  1. Daniela Wirthl1,*,
  2. Robert Pichler1,*,
  3. Michael Drack1,
  4. Gerald Kettlguber1,
  5. Richard Moser1,
  6. Robert Gerstmayr2,
  7. Florian Hartmann1,3,
  8. Elke Bradt2,
  9. Rainer Kaltseis1,
  10. Christian M. Siket1,
  11. Stefan E. Schausberger1,
  12. Sabine Hild2,
  13. Siegfried Bauer1 and
  14. Martin Kaltenbrunner3,
  1. 1Department of Soft Matter Physics, Johannes Kepler University Linz, Altenbergerstrasse 69, 4040 Linz, Austria.
  2. 2Institute of Polymer Science, Johannes Kepler University Linz, 4040 Linz, Austria.
  3. 3Linz Institute of Technology, Soft Electronics Laboratory, Johannes Kepler University Linz, 4040 Linz, Austria.
  1. Corresponding author. Email: martin.kaltenbrunner{at}jku.at
    • * These authors contributed equally to this work.

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