Research ArticleMATERIALS SCIENCE

Thermal conductivity in Bi0.5Sb1.5Te3+x and the role of dense dislocation arrays at grain boundaries

See allHide authors and affiliations

Science Advances  01 Jun 2018:
Vol. 4, no. 6, eaar5606
DOI: 10.1126/sciadv.aar5606

Article Information

vol. 4 no. 6

Online ISSN: 
History: 
  • Received for publication November 22, 2017
  • Accepted for publication April 17, 2018
  • .

Author Information

  1. Rigui Deng1,*,
  2. Xianli Su1,4,*,
  3. Zheng Zheng1,
  4. Wei Liu1,
  5. Yonggao Yan1,
  6. Qingjie Zhang1,
  7. Vinayak P. Dravid2,
  8. Ctirad Uher3,,
  9. Mercouri G. Kanatzidis2,4, and
  10. Xinfeng Tang1,
  1. 1State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China.
  2. 2Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  3. 3Department of Physics, University of Michigan, Ann Arbor, MI 48109, USA.
  4. 4Department of Chemistry, Northwestern University, Evanston, IL 60208, USA.
  1. Corresponding author. Email: tangxf{at}whut.edu.cn (X.T.); cuher{at}umich.edu (C.U.); m-kanatzidis{at}northwestern.edu (M.G.K.)
    • * These authors contributed equally to this work.

    Altmetric

    Article usage

    Article usage: May 2018 to October 2019

    AbstractFullPdf
    May 2018541
    Jun 20182726916920
    Jul 2018282170182
    Aug 20185198136
    Sep 2018018999
    Oct 20180245114
    Nov 20180236132
    Dec 2018020765
    Jan 201911330161
    Feb 20192315081
    Mar 20191916969
    Apr 20192518296
    May 20191410262
    Jun 20192110049
    Jul 20192212745
    Aug 2019118861
    Sep 2019107347
    Oct 2019106031

    Navigate This Article