Research ArticleMATERIALS SCIENCE

Thermal conductivity in Bi0.5Sb1.5Te3+x and the role of dense dislocation arrays at grain boundaries

See allHide authors and affiliations

Science Advances  01 Jun 2018:
Vol. 4, no. 6, eaar5606
DOI: 10.1126/sciadv.aar5606

Article Information

vol. 4 no. 6

Online ISSN: 
History: 
  • Received for publication November 22, 2017
  • Accepted for publication April 17, 2018
  • .

Author Information

  1. Rigui Deng1,*,
  2. Xianli Su1,4,*,
  3. Zheng Zheng1,
  4. Wei Liu1,
  5. Yonggao Yan1,
  6. Qingjie Zhang1,
  7. Vinayak P. Dravid2,
  8. Ctirad Uher3,,
  9. Mercouri G. Kanatzidis2,4, and
  10. Xinfeng Tang1,
  1. 1State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China.
  2. 2Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  3. 3Department of Physics, University of Michigan, Ann Arbor, MI 48109, USA.
  4. 4Department of Chemistry, Northwestern University, Evanston, IL 60208, USA.
  1. Corresponding author. Email: tangxf{at}whut.edu.cn (X.T.); cuher{at}umich.edu (C.U.); m-kanatzidis{at}northwestern.edu (M.G.K.)
  • * These authors contributed equally to this work.

Altmetric

Article usage

Article usage: May 2018 to March 2020

AbstractFullPdf
May 2018541
Jun 20182726916920
Jul 2018282170182
Aug 20185198136
Sep 2018018999
Oct 20180245114
Nov 20180236132
Dec 2018020765
Jan 201911330161
Feb 20192315081
Mar 20191916969
Apr 20192518296
May 20191410262
Jun 20192110049
Jul 20192212745
Aug 2019118861
Sep 2019107347
Oct 20191512555
Nov 2019512340
Dec 20191415146
Jan 2020911228
Feb 20201510742
Mar 2020107954

Stay Connected to Science Advances

Navigate This Article