Research ArticleMATERIALS SCIENCE
Mechanically active materials in three-dimensional mesostructures
- Xin Ning1,*,
- Xinge Yu2,*,
- Heling Wang3,*,
- Rujie Sun4,
- R. E. Corman5,
- Haibo Li3,
- Chan Mi Lee6,
- Yeguang Xue3,
- Aditya Chempakasseril2,
- Yao Yao2,
- Ziqi Zhang2,
- Haiwen Luan3,
- Zizheng Wang2,
- Wei Xia7,
- Xue Feng8,
- Randy H. Ewoldt5,
- Yonggang Huang3,
- Yihui Zhang8,† and
- John A. Rogers1,2,9,†
- 1Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
- 2Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
- 3Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
- 4Advanced Composites Centre for Innovation and Science, University of Bristol, Bristol BS8 1TR, UK.
- 5Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
- 6Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
- 7State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi’an Jiaotong University, Xi’an, Shaanxi 710049, China.
- 8Center for Mechanics and Materials, Center for Flexible Electronics Technology, and Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
- 9Department of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, USA.
- ↵†Corresponding author. Email: jrogers{at}northwestern.edu (J.A.R.); yihuizhang{at}tsinghua.edu.cn (Y.Z.)
↵* These authors contributed equally to this work.
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Science Advances 14 Sep 2018:
Vol. 4, no. 9, eaat8313
DOI: 10.1126/sciadv.aat8313
Vol. 4, no. 9, eaat8313
DOI: 10.1126/sciadv.aat8313
Xin Ning
Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Xinge Yu
Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Heling Wang
Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
Rujie Sun
Advanced Composites Centre for Innovation and Science, University of Bristol, Bristol BS8 1TR, UK.
R. E. Corman
Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Haibo Li
Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
Chan Mi Lee
Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Yeguang Xue
Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
Aditya Chempakasseril
Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Yao Yao
Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Ziqi Zhang
Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Haiwen Luan
Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
Zizheng Wang
Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Wei Xia
State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi’an Jiaotong University, Xi’an, Shaanxi 710049, China.
Xue Feng
Center for Mechanics and Materials, Center for Flexible Electronics Technology, and Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
Randy H. Ewoldt
Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Yonggang Huang
Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
Yihui Zhang
Center for Mechanics and Materials, Center for Flexible Electronics Technology, and Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
John A. Rogers
Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Department of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, USA.
