Research ArticleMATERIALS SCIENCE
Mechanically active materials in three-dimensional mesostructures
- View ORCID ProfileXin Ning1,*,
- View ORCID ProfileXinge Yu2,*,
- View ORCID ProfileHeling Wang3,*,
- View ORCID ProfileRujie Sun4,
- View ORCID ProfileR. E. Corman5,
- Haibo Li3,
- Chan Mi Lee6,
- View ORCID ProfileYeguang Xue3,
- Aditya Chempakasseril2,
- View ORCID ProfileYao Yao2,
- View ORCID ProfileZiqi Zhang2,
- View ORCID ProfileHaiwen Luan3,
- View ORCID ProfileZizheng Wang2,
- View ORCID ProfileWei Xia7,
- View ORCID ProfileXue Feng8,
- View ORCID ProfileRandy H. Ewoldt5,
- View ORCID ProfileYonggang Huang3,
- View ORCID ProfileYihui Zhang8,† and
- View ORCID ProfileJohn A. Rogers1,2,9,†
- 1Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
- 2Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
- 3Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
- 4Advanced Composites Centre for Innovation and Science, University of Bristol, Bristol BS8 1TR, UK.
- 5Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
- 6Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
- 7State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi’an Jiaotong University, Xi’an, Shaanxi 710049, China.
- 8Center for Mechanics and Materials, Center for Flexible Electronics Technology, and Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
- 9Department of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, USA.
- ↵†Corresponding author. Email: jrogers{at}northwestern.edu (J.A.R.); yihuizhang{at}tsinghua.edu.cn (Y.Z.)
↵* These authors contributed equally to this work.
See allHide authors and affiliations
Science Advances 14 Sep 2018:
Vol. 4, no. 9, eaat8313
DOI: 10.1126/sciadv.aat8313
Vol. 4, no. 9, eaat8313
DOI: 10.1126/sciadv.aat8313
Xin Ning
1Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Xinge Yu
2Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Heling Wang
3Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
Rujie Sun
4Advanced Composites Centre for Innovation and Science, University of Bristol, Bristol BS8 1TR, UK.
R. E. Corman
5Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Haibo Li
3Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
Chan Mi Lee
6Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Yeguang Xue
3Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
Aditya Chempakasseril
2Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Yao Yao
2Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Ziqi Zhang
2Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Haiwen Luan
3Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
Zizheng Wang
2Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Wei Xia
7State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi’an Jiaotong University, Xi’an, Shaanxi 710049, China.
Xue Feng
8Center for Mechanics and Materials, Center for Flexible Electronics Technology, and Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
Randy H. Ewoldt
5Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Yonggang Huang
3Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
Yihui Zhang
8Center for Mechanics and Materials, Center for Flexible Electronics Technology, and Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
John A. Rogers
1Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
2Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
9Department of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, USA.
