Science Advances

Supplementary Materials

This PDF file includes:

  • Supplementary Text
  • fig. S1. Thermal circuit model of textiles.
  • fig. S2. Direct copper deposition on carbon/nanoPE.
  • fig. S3. Schematic of thermal measurement apparatus.
  • fig. S4. Sweating hotplate thermal measurement.
  • fig. S5. Emissivities of samples #1 to #4 used in the experiments.
  • fig. S6. Complete thermal measurement and weighted average emissivity of various samples.
  • fig. S7. Wearability tests of dual-mode textile, T-shirt, and sweatshirt.
  • fig. S8. Performance durability of dual-mode textile against wash cycles.
  • fig. S9. Comparison between IR-transparent and IR-opaque dual-mode textiles.
  • fig. S10. Emissivities of alternative materials for bilayer emitters.
  • fig. S11. Calculated comfortable ambient temperature as the function of top- and bottom-layer emissivities at Tskin = 34°C.
  • fig. S12. Guarded hotplate setup for thermal conductivity measurement.
  • fig. S13. Emissivity spectrum of the traditional textile.
  • fig. S14. Weighted average emissivities of heating mode, cooling mode, and traditional textiles as a function of temperature.
  • fig. S15. Overlay of thermal measurement data on the numerical fitting result.
  • fig. S16. Measurement of specular, diffuse, and angle-dependent emissivities.
  • table S1. Thickness of dual-mode textiles.
  • table S2. Numerically fitted values of heat transfer components.
  • table S3. Thermal properties of the dual-mode and the traditional textiles measured by guarded hotplate method.
  • References (35, 36)

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