Science Advances

Supplementary Materials

This PDF file includes:

  • section S1. Bulk gallium structural analysis
  • section S2. Stability of gallenene sheets
  • section S3. Effect of thickness on the band structure of gallenene
  • section S4. Stamping technique of solid-melt exfoliation
  • section S5. AFM analysis of Ga films
  • section S6. Contact angle measurements
  • section S7. Substrate effects on gallenene
  • section S8. Absorption measurements on gallenene
  • section S9. XPS measurements on Ga/MoS2 heterostructures
  • section S10. Structural stability of Ga/MoS2 heterostructures
  • section S11. Thermal conductivity of gallenene
  • section S12. Defects in gallenene
  • section S13. Polymorphism in gallenene
  • section S14. Exfoliation of ultrathin Sn sheets
  • fig. S1. Structure of gallium.
  • fig. S2. Bonding nature of gallium.
  • fig. S3. Phonon dispersion of gallenene.
  • fig. S4. Effect of number of layers of gallenene b010.
  • fig. S5. Effect of number of layers of gallenene a100.
  • fig. S6. Stamping technique used for simultaneous exfoliation of multiple samples.
  • fig. S7. AFM analysis.
  • fig. S8. Thickness for different substrates.
  • fig. S9. Contact angle measurements.
  • fig. S10. Gallenene on different substrates.
  • fig. S11. Gallenene on Si.
  • fig. S12. Gallenene on Si.
  • fig. S13. Gallenene on Ag.
  • fig. S14. Gallenene on Al.
  • fig. S15. Gallenene on Si.
  • fig. S16. Gallenene on Ni.
  • fig. S17. Gallenene on GaN.
  • fig. S18. Band structure of gallenene on different substrates.
  • fig. S19. XPS measurements of heterostructures.
  • fig. S20. Structure of heterostructure.
  • fig. S21. Thermal properties of gallenene.
  • fig. S22. Thermal conductivity variation as a function of temperature.
  • fig. S23. Defects in gallenene.
  • fig. S24. Defects in gallenene.
  • fig. S25. Polymorphism.
  • fig. S26. Thin film of tin.
  • table S1. Contact angle of Ga on different substrates.
  • table S2. Structural parameters of the substrate and gallenene.
  • References (80–84)

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