Science Advances

Supplementary Materials

This PDF file includes:

  • Note S1. Step-by-step fabrication procedures for 3D compliant and stretchable thermoelectric coils.
  • Note S2. Power optimization in thermoelectric harvesters.
  • Note S3. Effect of PI width on the pop-up yield for 3D coils.
  • Note S4. Mechanical compression test.
  • Fig. S1. Schematic step-by-step fabrication procedures for 3D compliant and stretchable thermoelectric coils.
  • Fig. S2. Design of the 2D precursor for the 8 × 8 array.
  • Fig. S3. Illustration of geometric parameters.
  • Fig. S4. Mechanics of the in-plane stretching process for the 3D spring coil.
  • Fig. S5. Polyimide width effect on yield of buckle-up process.
  • Fig. S6. Simulated strain/stress distribution in the encapsulation and metal layers.
  • Fig. S7. Mechanical compression testing.
  • Fig. S8. Mechanics of the vertical compression process of the 3D spring coil.
  • Fig. S9. Schematic illustration of the testing setup for measuring the thermoelectric response of the devices.
  • Fig. S10. Thermoelectric properties for heavily doped n-type and p-type silicon thin films measured in the silicon-on-insulator wafer form before patterning.
  • Fig. S11. Output characteristics of the 3 × 1 harvester shown in Fig. 1B.
  • Fig. S12. Preliminary thermal modeling by replacing silicon with other thermoelectric materials.
  • Fig. S13. The design that uses multilayer stacking to improve the power density.

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