Science Advances
Supplementary Materials
The PDF file includes:
- Supplementary Text
- Fig. S1. Schematics of the Al2O3-CNT SNE fabrication procedure.
- Fig. S2. Diagram and optical images of unpackaged LED chiplets (UT170-31, CREE) used in picking and placing demonstration.
- Fig. S3. Atomic force microscopy (AFM) system used for indentation tests with external voltages.
- Fig. S4. Adhesion on/off ratio (ratio of pull-off force with an external voltage to that without voltage) of Al2O3-coated surfaces with and without SNE on a TiN layer.
- Fig. S5. Optical microscope images of a paper towel showing its microscopically porous and rough surface.
- Fig. S6. Transmission electron microscopy images of Al2O3 coating on individual CNT fibers via ALD with different numbers of cycles.
- Fig. S7. Al2O3-CNT SNEs grown with different CVD procedures, exhibiting different CNT densities.
- Fig. S8. Pull-off forces of Al2O3-CNT SNEs with different heights according to applied voltages.
- Fig. S9. Pull-off forces of Al2O3-CNT SNEs measured by AFM using a 4 μm Pt-coated spherical tip with different applied external voltages and preloads.
- Fig. S10. Pull-off forces of Al2O3 coated TiN layer measured by AFM using a 4 μm Pt-coated spherical tip with different applied external voltages and preloads.
- Fig. S11. Pull-off forces of SNE measured by AFM indentation using a 10-μm SiO2 spherical tip with and without the shear motion.
- Fig. S12. Schematics of adhesion tests on an Al2O3-TiN surface using a microsphere.
- Fig. S13. Contact mechanics modeling of adhesion between an Al2O3-CNT nanocomposite surface and a microsphere.
- Fig. S14. Adhesive and gravitational forces along the object size.
- Fig. S15. Optical microscope images of PS microspheres picked from a spin-coated layer using a patterned SNE surface and placed on a silicon wafer surface, under on or off electrical voltage conditions.
- Fig. S16. Picking-and-placing of stainless steel (SS) microparticles, sized 15-45 μm, using a 200 μm by 200 μm Al2O3-CNT SNE, from a silicon wafer to a transparent substrate.
- Legends for movies S1 and S2
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