Science Advances

Supplementary Materials

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  • Fig. S1. Schematic of structures of TMDs and Cu-intercalated TMDs.
  • Fig. S2. AIMD simulations of the stability of different coverages of Cu on NbS2 at 900°C.
  • Fig. S3. Morphologies of TMDs.
  • Fig. S4. PXRD patterns of different TMDs after reaction with Cu.
  • Fig. S5. Morphology evolution of Cu and CuxNbS2 with different reaction duration.
  • Fig. S6. Elemental distribution of nanometer CuxNbS2.
  • Fig. S7. Elemental distribution of micrometer CuxNbS2.
  • Fig. S8. Morphology evolution of Cu and 2H-WS2 with the stirring time.
  • Fig. S9. PXRD patterns of Cu and 2H-WS2 mixed powders by an atomic ratio of 1.2:1.0 under different stirring time.
  • Fig. S10. Elemental distribution of Cu and 2H-WS2 mixed powder by atomic ratio of 1.2:1.0 after stirring for 10 days.
  • Fig. S11. TEM images of Cu and WS2 mixed powder by an atomic ratio of 1.2:1.0 after stirring for 10 days.
  • Fig. S12. Morphology evolution of Cu and 2H-MoS2 with the stirring time.
  • Fig. S13. PXRD patterns of Cu and 2H-MoS2 mixed powders by an atomic ratio of 1.2:1.0 under different stirring time.
  • Fig. S14. Morphology, composition, and size distribution of Cu and 2H-MoS2 after mixing for 10 days.
  • Fig. S15. Elemental distribution of Cu and MoS2 mixed powder by an atomic ratio of 1.2:1.0 after stirring for 10 days.
  • Fig. S16. PXRD patterns of Cu1.2NbS2 with different time under stirring.
  • Fig. S17. PXRD patterns of CuxNbS2 by adding different Cu contents and after stirring for the same 5 ays.
  • Fig. S18. The c lattice constant as a function of Cu concentration in CuxNbS2.
  • Fig. S19. Electron probe microanalysis of CuxNbS2 with different Cu content.
  • Fig. S20. PXRD patterns of NbS2 with different Cu sources.
  • Fig. S21. Ex situ PXRD patterns of microsized NbS2 and Cu mixed powder (atomic ratio 1:1.5) after stirring time in hexane.
  • Fig. S22. In situ PXRD patterns of microsized CuxNbS2 (atomic ratio Cu:NbS2 = 1.5:1) from 66 to 118 hours.
  • Fig. S23. The intensity of (002) peak ratio between NbS2 and CuxNbS2 in figs. S21 and S22.
  • Fig. S24. Time-resolved in situ PXRD measurement of nanosized NbS2 coating on the Cu sheet.
  • Fig. S25. High-resolution high-angle annular dark field (HAADF)–STEM images of Cu1.2NbS2 along the 001 direction.
  • Fig. S26. Theoretical computing of the charge density of NbS2 and CuNbS2.
  • Fig. S27. Cross-sectional morphology and vertical electrical conductivity of 2H-NbS2 and CuxNbS2.
  • Table S1. Gibbs free energy change of Cu intercalation with different Cu intercalation states.
  • Table S2. Elemental ratios in CuxNbS2 analyzed by electron probe microanalysis.
  • Table S3. The structural parameters of Cu1.2NbS2.

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