PT - JOURNAL ARTICLE AU - Lee, Kwon-Hyung AU - Lee, Seong-Sun AU - Ahn, David B. AU - Lee, Jaehyun AU - Byun, Doyoung AU - Lee, Sang-Young TI - Ultrahigh areal number density solid-state on-chip microsupercapacitors via electrohydrodynamic jet printing AID - 10.1126/sciadv.aaz1692 DP - 2020 Mar 01 TA - Science Advances PG - eaaz1692 VI - 6 IP - 10 4099 - http://advances.sciencemag.org/content/6/10/eaaz1692.short 4100 - http://advances.sciencemag.org/content/6/10/eaaz1692.full SO - Sci Adv2020 Mar 01; 6 AB - Microsupercapacitors (MSCs) have garnered considerable attention as a promising power source for microelectronics and miniaturized portable/wearable devices. However, their practical application has been hindered by the manufacturing complexity and dimensional limits. Here, we develop a new class of ultrahigh areal number density solid-state MSCs (UHD SS–MSCs) on a chip via electrohydrodynamic (EHD) jet printing. This is, to the best of our knowledge, the first study to exploit EHD jet printing in the MSCs. The activated carbon-based electrode inks are EHD jet-printed, creating interdigitated electrodes with fine feature sizes. Subsequently, a drying-free, ultraviolet-cured solid-state gel electrolyte is introduced to ensure electrochemical isolation between the SS–MSCs, enabling dense SS–MSC integration with on-demand (in-series/in-parallel) cell connection on a chip. The resulting on-chip UHD SS–MSCs exhibit exceptional areal number density [36 unit cells integrated on a chip (area = 8.0 mm × 8.2 mm), 54.9 cells cm−2] and areal operating voltage (65.9 V cm−2).