PT  - JOURNAL ARTICLE
AU  - Lee, Kwon-Hyung
AU  - Lee, Seong-Sun
AU  - Ahn, David B.
AU  - Lee, Jaehyun
AU  - Byun, Doyoung
AU  - Lee, Sang-Young
TI  - Ultrahigh areal number density solid-state on-chip microsupercapacitors via electrohydrodynamic jet printing
AID  - 10.1126/sciadv.aaz1692
DP  - 2020 Mar 01
TA  - Science Advances
PG  - eaaz1692
VI  - 6
IP  - 10
4099  - http://advances.sciencemag.org/content/6/10/eaaz1692.short
4100  - http://advances.sciencemag.org/content/6/10/eaaz1692.full
SO  - Sci Adv2020 Mar 01; 6
AB  - Microsupercapacitors (MSCs) have garnered considerable attention as a promising power source for microelectronics and miniaturized portable/wearable devices. However, their practical application has been hindered by the manufacturing complexity and dimensional limits. Here, we develop a new class of ultrahigh areal number density solid-state MSCs (UHD SS–MSCs) on a chip via electrohydrodynamic (EHD) jet printing. This is, to the best of our knowledge, the first study to exploit EHD jet printing in the MSCs. The activated carbon-based electrode inks are EHD jet-printed, creating interdigitated electrodes with fine feature sizes. Subsequently, a drying-free, ultraviolet-cured solid-state gel electrolyte is introduced to ensure electrochemical isolation between the SS–MSCs, enabling dense SS–MSC integration with on-demand (in-series/in-parallel) cell connection on a chip. The resulting on-chip UHD SS–MSCs exhibit exceptional areal number density [36 unit cells integrated on a chip (area = 8.0 mm × 8.2 mm), 54.9 cells cm−2] and areal operating voltage (65.9 V cm−2).